Inhaltszusammenfassung zur Seite Nr. 1
Chip RC Networks
Chip RC Networks
Type:
EZASTB/SSB
Type:
EZACT
EZADT
EZAST/SS
EZANT
GND GND
GND
GND
■ Features
Smallest SMD R/C networks
● 4 popular noise reduction circuits made
EZACT : 2.0 mm 1.2 mm 0.6 mm, 0.5 mm pitch (Flat terminal type)
EZADT : 3.2 mm 1.6 mm 0.65 mm, 0.635 mm pitch (Concave terminal type)
EZAST/SS : 4.0 mm 2.1 mm 0.65 mm, 0.8 mm pitch (Concave terminal type)
EZASTB/SSB : 4.0 mm 2.1 mm 0.65 mm, 0.65 mm pitch (Co
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Chip RC Networks ■ Explanation of Part Numbers ● EZACT (R/C Standard Combination) 1 2 3 4 5 6 7 8 9 10 11 12 E Z A C T 3 0 A A A J R/C Standard Combination Design Resistance Suffix for Special Common Code Dimension and Configuration Tolerance Requirement Circuit Configuration Thick Film Noise 2.0 mm Chip RC Resistance Value Capacitance Value AAA J ±5% Standard CT 1.2 mm Networks Configuration Configuration Suppression and Filtering 0 10 0 10 pF Components 1 22 1 22 pF 2 47 3 100 4 220 5 47
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Chip RC Networks ■ Explanation of Part Numbers ● EZASSB (R/C Except the standard Com bi na tion) 1 2 3 4 5 6 7 8 9 10 11 12 E Z A S S B 7 0 1 A J Common Code Dimension and Design Number Resistance Suffix for Special Circuit Configuration Tolerance Requirement Thick Film Noise Convex Resistance Value : 10 to 100 k J ±5% Capacitance Value : 10 pF to 180 pF Suppression and terminal type 4.0 mm SSB Filtering Chip RC In above-mentioned range, it is possible to 2.1 mm choose optional R/C. Component
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Chip RC Networks ■ Dimensions in mm(not to scale) EZACT EZADT 0.33±0.10 10 9 87 10 9 87 1 6 1 6 23 45 0.635±0.100 23 45 + 0.20 0.5±0.1 0.25±0.15 3.20±0.15 0.65 –0.10 2.0±0.1 0.55±0.10 0.35±0.15 0.35±0.10 0.30±0.15 0.20±0.15 Size : 0805 inches Size : 1206 inches Mass (Weight) [1000 pcs.] :4 g Mass (Weight) [1000 pcs.] :11 g EZAST/SS EZANT 0.5±0.2 10 9 87 10 9 87 1 6 1 6 33 23 45 1.27±0.10 0.65±0.20 23 45 0.8±0.1 + 0.20 6.4±0.2 0.80 – + 0.10 0.20 4.0±0.2 0.65 –0.10 0.45±0.20 0.75±0.20 0.4±0.2 0.5±
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100/47pF 100 / 100 pF 100 / 100 pF 100 /47pF 100 /22pF 100/22pF 100/22pF 100 /10pF 1k/330 pF 1k / 1000 pF Chip RC Networks ■ Ratings Item Specifi cation 10 to 100 k Resistance Values EZAC Standard : 10 , 22 , 47 , 100 , 220 , 470 , 1 k EZAD/S/N Standard : 22 , 47 , 100 , 220 , 470 , 1 k Resistance Tolerance ±5 % –6 Temperature Coeffi cient of Resistance (T.C.R.) ±200 10 /°C(ppm/°C) (1) EZAC : 0.031 W(<70 °C ) Rated Power (1) EZAD/S/N : 0.063 W(<70 °C ) (2
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Chip RC Networks ■ Packaging Methods (Taping) ● Standard Quantity Type Kind of Taping Pitch (P ) Quantity 1 EZACT Punched Carrier Taping 5000 pcs./reel EZADT EZAST/SS 4 mm EZASTB/SSB Embossed Carrier Taping 4000 pcs./reel EZANT ● Carrier Tape (Unit : mm) P P P 1 2 0 fD0 T A T fD (Only Emboss) 1 Type A B W F E P P P fD T fD 1 2 0 0 1 ±0.15 ±0.20 EZACT 1.65 2.40 ±0.20 ±0.05 ±0.10 ±0.05 8.00 3.50 1.75 0.85 — ±0.20 ±0.20 EZADT 2.00 3.60 ±0.10 ±0.05 ±0.10 +0.10 EZAST/SS 4.00 2.00 4.00 1.50 −0 ±0.20
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Chip RC Networks ■ Recommended Land Pattern Design ●EZACT b g P Landpattern abcd Dimensions 0.75 0.25 1.70 0.35 (mm) c eh g P h Dimensions 1.85 2.60 0.25 0.60 (mm) b P EZADT ● Landpattern abcd Dimensions 0.9 to 1.1 0.2 to 0.3 2.6 to 2.8 0.3 to 0.4 (mm) fg P Dimensions 2.0 to 2.6 3.6 to 4.2 0.635 c (mm) g EZAST/SS ● Solderresistant f2 c Landpattern abcd Dimensions 1.2 to 1.4 0.4 3.1 to 3.3 0.4 to 0.5 (mm) GND ef1 f2 P Dimensions 0.8 2.9 to 3.3 4.8 to 5.2 0.8 (mm) b P ●EZASTB/SSB f2 Landpat
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Chip RC Networks ■ Recommended Soldering Conditions Recommendations and precautions are described below. Recommended soldering conditions for refl ow ● ·Refl ow soldering shall be performed a maximum of For soldering (Example : Sn/Pb) two times. Temperature Time ·Please contact us for additional information when Preheating 140 °C to 160 °C 60 s to120 s used in conditions other than those specifi ed. Main heating Above 200 °C 30 s to 40 s ·Please measure the temperature of the terminals an
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Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements]) When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. Do not use the products beyond the specifi cations described in this catalog. This catalog explains the quality and performance of the products as individ
