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User's Guide
SCDU001A–July 2009–Revised October 2009
TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2
Multiplexer/Demultiplexer Switch Evaluation Module
Contents
1 Preface ....................................................................................................................... 2
2 Introduction .................................................................................................................. 3
3 EVM Configuration and Description .......................................
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Preface www.ti.com 1 Preface 1.1 About This Manual This user’s guide describes the TS3USB221/A/E Evaluation Module (EVM). This guide contains the EVM schematics, bill of materials, assembly drawings, and top and bottom board layouts. 1.2 How to Use This Manual This document contains the following chapters: • Chapter 1 – Preface • Chapter 2 – Introduction and Quick Start • Chapter 2 – EVM Configuration and Description • Chapter 3 – Related Documents 1.2.1 Information about Cautions and Warnings A
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www.ti.com Introduction 2 Introduction The TS3USB221/A/E EVM is an evaluation module for the Texas Instruments (TI) 1:2 multiplexer/demultiplexer high-bandwidth USB switches. It is specially designed for high-speed USB 2.0 signals, supports bidirectional signaling, and offers high-bandwidth (1.1 GHz). When interfacing other USB devices with this EVM, the switch allows signals to pass with minimum edge and phase distortion as well as little or no signal attenuation. This evaluation module is desi
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Introduction www.ti.com 2.2 Quick Start TS3USB221/A/E EVM TS3USB221/A/E Figure 2. Quick Start Evaluation 1. Connect the PC to the USB connector J3 through a USB cable. 2. Make sure the 3.3-V LDO output is enabled by opening J8 without a jumper. 3. Make sure the TS3USB221/A/E IC is enabled by shunting J7 with a jumper. 4. Connect two USB downstream devices (for example, mouse, keyboard, USB memory stick, etc) to J4 and J5 on the EVM. 5. To select USB downstream device 1 connected to J4, make sure
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www.ti.com EVM Configuration and Description 3 EVM Configuration and Description 3.1 EVM Description To conform to the USB 2.0 specification, the differential traces D+ and D- lines on the board are impedance matched to 90- Ω differential. The trace length of the through-path and the trace length through the TS3USB221/A/E switch are also matched for comparison purpose. The PCB is a simple four-layer top-side populated board (see the schematic and PCB layout in Section 3.4 and Section 3.5). The m
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EVM Configuration and Description www.ti.com 3.3 Board Stack-Up Table 3 shows the board stack-up. Table 3. Board Stack-Up Subclass Thickness Dielectric Loss Width Impedance Coupling Spacing Diff Z o Type Shield Name (mils) Constant Tangent (mils) ( Ω) Type (mils) ( Ω) 1 SURFACE 2 TOP CONDUCTOR 2.4 1 0 7.5 47.72 EDGE 7.5 85.004 3 DIELECTRIC 4 4.1 0.035 4 GND PLANE 1.2 1 0 YES 5 DIELECTRIC 48 4.1 0.035 6 VCC PLANE 1.2 1 0 YES 7 DIELECTRIC 4 4.1 0.035 7.5 47.72 EDGE 7.5 85.004 8 BOTTOM CONDUCTOR 2.
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www.ti.com EVM Configuration and Description 3.4 Schematics Figure 4. EVM Schematic 7 SCDU001A–July 2009–Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
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EVM Configuration and Description www.ti.com 3.5 PCB Layout Figure 5. Top Silkscreen/Assembly 8 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer SCDU001A–July 2009–Revised October 2009 Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
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www.ti.com EVM Configuration and Description Figure 6. Top Metal (High-Speed Differential) 9 SCDU001A–July 2009–Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
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EVM Configuration and Description www.ti.com Figure 7. Internal Ground Plane 10 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer SCDU001A–July 2009–Revised October 2009 Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
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www.ti.com EVM Configuration and Description Figure 8. Internal Power Plane 11 SCDU001A–July 2009–Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
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EVM Configuration and Description www.ti.com Figure 9. Bottom Metal (Low-Speed Single-Ended) 12 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer SCDU001A–July 2009–Revised October 2009 Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
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www.ti.com EVM Configuration and Description Figure 10. Bottom Silkscreen/Assembly 13 SCDU001A–July 2009–Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
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Related Documentation www.ti.com 3.6 Bill of Materials Table 4. Bill of Materials Count RefDes Value Description Size Part Number Manufacturer 2 J1, J3 – USB Connector Type A – AU-Y1005 Assmann Electronics Inc Molex / Waldom 3 J2, J4, J5 – USB Connector Type B – 67068-9000 Electronics 100 mil x Sullins Connector 3 J6, J7, J8 – Header, 2x1pin, 100mil spacing PEC36SAAN 100 mil Solutions 2 C1, C4 1.0 μF Capacitor, Ceramic, 1.0uF, X7R, 10% 805 Std Std 1 C2 10 nF Capacitor, Ceramic, 10nF, X7R, 10% 80
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