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INTEGRATED CIRCUITS
DATA SHEET
TDA2614
6 W hi-fi audio power amplifier
July 1994
Product specification
File under Integrated Circuits, IC01
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 FEATURES GENERAL DESCRIPTION • Requires very few external components The TDA2614 is a power amplifier in a 9-lead single-in-line (SIL9) plastic medium power package. It has been • No switch-on/switch-off clicks especially designed for mains fed applications, such as TV • Input mute during switch-on and switch-off and radio. • Low offset voltage between output and ground • Hi-fi in accordance with IEC 268 and DIN 45
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 + V P handbook, full pagewidth 7 4 kΩ 2 MUTE 5 kΩ + V P TDA2614 V ref3 10 kΩ + V P + V ref2 V 3 ref1 1/2 V / GND THERMAL P PROTECTION voltage comparator V V 10 kΩ AB – V ref2 – V – V P P 20 kΩ 6 OUT 9 CM INV 680 Ω 8 V INV B 20 kΩ V 1 ref1 n.c. substrate V 4 A n.c. 5 MCD371 - 1 GND / V P Fig.1 Block diagram. July 1994 3
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 PINNING FUNCTIONAL DESCRIPTION The TDA2614 is a hi-fi power amplifier designed for mains SYMBOL PIN DESCRIPTION fed applications, such as radio and TV. The circuit is n.c. 1 not connected optimally designed for asymmetrical power supplies, but is MUTE 2 mute input also well-suited to symmetrical power supply systems. 1/2V /GND 3 1/2 supply (or ground at P An output power of 6 W (THD = 0.5%) can be delivered symmetr
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 LIMITING VALUES In accordance with the Absolute maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V positive supply voltage - 42 V P I non-repetitive peak output current - 4A OSM P total power dissipation see Fig.3 - 15 W tot T storage temperature range - 55 +150 °C stg T crystal temperature -+ 150 °C XTAL T ambient operating temperature range - 25 +150 °C amb t short circuit time short circuit t
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply V supply voltage range - 24 42 V P I repetitive peak output current - 2.2 - A ORM Operating position; note 1 V supply voltage range 15 24 42 V P I total quiescent current 10 20 35 mA P P output power O THD = 0.5% 5 6.5 - W THD = 10% 6.5 8.5 - W THD = 0.5%; R = 4Ω- 10 - W L THD = 10%; R = 4 Ω- 14 - W L THD total harmonic distortion P = 4 W - 0.15
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Operating position; note 6 ±V supply voltage range 7.5 12 21 V P I total quiescent current 10 20 35 mA P P output power O THD = 0.5% 5 6.5 - W THD = 10% 6.5 8 - W THD total harmonic distortion P = 4 W - 0.13 0.2 % o B power bandwidth THD = 0.5%; note 2 - 40 to - Hz 20000 G voltage gain 29 30 31 dB v V noise output voltage note 3 - 70 140 μV no |Z | input impedance 14
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 mute input + V P handbook, full pagewidth 680 μF 2 7 3 TDA2614 20 kΩ 100 nF 220 nF 9 V I 6 22 nF 680 Ω 20 kΩ 8 8.2 Ω R = 8 Ω L 5 – V P MCD370 680 μF Fig.4 Test and application circuit with symmetrical power supply. R V S P V mute input S handbook, full pagewidth 100 nF 680 μF 2 7 3 internal 1/2 P 100 μF TDA2614 20 kΩ 220 nF 9 V I 6 22 nF 680 μF 680 Ω 20 kΩ 8 8.2 Ω R = 8 Ω L 5 MCD369 Fig.5 Test and applic
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D 1 q A P P 2 1 A 3 q 2 q 1 A A 4 E pin 1 index c L 19 b Z e Q b w M 2 b 1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) A 2 Z (1) (1) UNIT A Abc b b D D E eL P P Q q q q w A 3 4 1 2 1 1 1 2 max. max. 18.5 8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 3.9 2.75 3.4 1.75 15.1 4.4 5.9 2.54 mm 3.7 0.25 1.0
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 SOLDERING The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the Introduction specified maximum storage temperature (T ). If the stg max printed-circuit board has been pre-heated, forced cooling There is no soldering method that is ideal for all IC may be necessary immediately after soldering to keep the packages. Wave soldering is often preferred when tempera
