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INTEGRATED CIRCUITS
DATA SHEET
TDA1015
1 to 4 W audio power amplifier
November 1982
Product specification
File under Integrated Circuits, IC01
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 The TDA1015 is a monolithic integrated audio amplifier circuit in a 9-lead single in-line (SIL) plastic package. The device is especially designed for portable radio and recorder applications and delivers up to 4 W in a 4 Ω load impedance. The very low applicable supply voltage of 3,6 V permits 6 V applications. Special features are: • single in-line (SIL) construction for easy mounting • separated preamplifier and
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 November 1982 3 Fig.1 Circuit diagram.
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 RATINGS Limiting values in accordance with Absolute Maximum System (IEC 134) Supply voltage V max. 18 V P Peak output current I max. 2,5 A OM Total power dissipation see derating curve Fig.2 Storage temperature T - 55 to + 150 °C stg Operating ambient temperature T - 25 to + 150 °C amb A.C. short-circuit duration of load during sine-wave drive; V = 12 V t max. 100 hours P sc Fig.2 Power derating curve. HEATSINK DE
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 D.C. CHARACTERISTICS Supply voltage range V 3,6 to 18 V P Repetitive peak output current I <2 A ORM typ. 14 mA Total quiescent current at V = 12 V I P tot <25 mA A.C. CHARACTERISTICS T = 25 °C; V = 12 V; R = 4 Ω; f = 1 kHz unless otherwise specified; see also Fig.3. amb P L A.F. output power at d = 10% (note 1) tot with bootstrap: V = 12 V; R = 4 Ω P typ. 4,2 W P L o V = 9 V; R = 4 Ω P typ. 2,3 W P L o V = 6 V; R =
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Notes 1. Measured with an ideal coupling capacitor to the speaker load. 2. Measured with a load resistor of 20 kΩ. 3. Measured at P = 1 W; the frequency response is mainly determined by C1 and C3 for the low frequencies and by o C4 for the high frequencies. 4. Independent of load impedance of preamplifier. 5. Unweighted r.m.s. noise voltage measured at a bandwidth of 60 Hz to 15 kHz (12 dB/octave). 6. Ripple reject
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 APPLICATION INFORMATION Fig.4 Circuit diagram of a 1 to 4 W amplifier. Fig.5 Total quiescent current as a function of supply voltage. November 1982 7
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Fig.6 Total harmonic distortion as a function of output power across R ; ── with bootstrap; --- without L bootstrap; f = 1 kHz; typical values. The available output power is 5% higher when measured at pin 2 (due to series resistance of C10). Fig.7 Output power across R as a function of supply voltage with bootstrap; d = 10%; typical values. L tot The available output power is 5% higher when measured at pin 2 (due t
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Fig.8 Voltage gain as a function of frequency; P relative to 0 dB = 1 W; V = 12 V; R = 4 Ω. o P L Fig.9 Total harmonic distortion as a function of frequency; P = 1 W; V = 12 V; R = 4 Ω. P L November 1982 9
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Fig.10 Ripple rejection as a function of R2 (see Fig.4); R = 0; typical values. S Fig.11 Noise output voltage as a function of R2 (see Fig.4); measured according to A-curve; capacitor C5 is adapted for obtaining a constant bandwidth. November 1982 10
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Fig.12 Noise output voltage as a function of frequency; curve a: total amplifier; curve b: power amplifier; B = 5 kHz; R = 0; typical values. S Fig.13 Voltage gain as a function of R2 (see Fig.4). November 1982 11
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D 1 q A P P 2 1 A 3 q 2 q 1 A A 4 E pin 1 index c L 19 b Z e Q b w M 2 b 1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) A 2 Z (1) (1) UNIT A Abc b b D D E eL P P Q q q q w A 3 4 1 2 1 1 1 2 max. max. 18.5 8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 3.9 2.75 3.4 1.75 15.1 4.4 5.9 2.54 mm 3.7 0.25 1.0
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Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief
